LG has announced that it has partnered with Infineon Technologies AG for Infineon REAL3 image sensor chip with Time-of-Flight (ToF) technology in the front-facing camera in upcoming LG G8 ThinQ that will be unveiled in Barcelona during Mobile World Congress 2019 on February 24th. It is built by Infineon and pmdtechnologies with algorithms for processed 3D point clouds. ToF image sensor chip offers more accurate measurements by capturing infrared light making it faster and more effective in ambient light, reducing the workload on the application processor thereby also reducing power consumption Since ToF sees objects in 3D and is not affected by light from external sources, it promises excellent recognition rate, both indoors and out for use in augmented reality (AR) and virtual reality (VR) applications. Andreas Urschitz, division president of Infineon’s Power Management & Multimarket division, said: Infineon is poised to revolutionize the market. We have demonstrated service beyond the mere product level – specifically catering to phone OEMs, associated reference design houses and camera module manufacturers. Within five years, we expect 3D cameras to be found in most smartphones and Infineon will contribute a significant share. Chang Ma, senior vice president and head of Product Strategy at LG Mobile Communications Company, said: Keeping in mind ...
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