In the latest development, Samsung Electronics announced its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4) for high-performance applications. What is I-Cube? Samsung’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.), and several High Bandwidth Memory (HBM) dies on top of a silicon interposer making multiple dies operate … Continue reading "Samsung introduces I-Cube4 packaging tech for faster and more efficient chips"
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