Intel has announced the launch of new Core processors, code-named “Lakefield” with Hybrid CPUs. These processors leverage Intel’s Foveros 3D Packaging technology that enables the various IPs to be stacked in three dimension instead of two, reducing the package size and increasing power efficiency. At launch, the Lakefield CPUs will come in two SKUs — … Continue reading "Intel Lakefield based Hybrid Core i3 and Core i5 CPUs announced for foldables and ultrathin laptops"
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