It has been about two weeks since the Xiaomi Mi Max 3 got certified by TENAA in China. Now the company's CEO Lei Jun has finally shared an image of the retail box of the smartphone. He also said that everyone is talking about the Mi Max 3 conference and people are asking to release it early. However he did not share the official announcement date for the smartphone. According to the listing, the phone is said to pack a 6.99-inch Full HD+ 18:9 aspect ratio screen, will be powered by a 1.8GHz Octa-Core SoC (Should be Snapdragon 636) with up to 6GB of RAM, run Android 8.1 (Oreo) and pack a 12-megapixel rear camera with Sony IMX363 sensor, along with a secondary rear camera with AI portraits. The phone is said to feature a metal body, fingerprint sensor on the back and a 5400mAh battery with support for Qualcomm Quick Charge 3.0 using the bundled 18W charger. Xiaomi Mi Max 3 rumored specifications 6.99-inch (2160 x 1080 pixels) Full HD+ IPS 2.5D curved glass display 1.8GHz Octa-Core Snapdragon 636 14nm Mobile Platform with Adreno 509 GPU 3GB RAM with 32GB, 4GB RAM with 64GB storage, 6GB RAM with 128GB storage MIUI ...
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