Samsung introduced the Exynos 2400 Deca-Core processor this week that powers the Galaxy S24 and the S24+ smartphones in India and European countries. The company said that Exynos 2400 the first Exynos processor to use a Fan-out Wafer Level Package (FOWLP) to boost thermal management. The Fan-out Wafer Level Package (FOWLP) makes more space for … Continue reading "Samsung Exynos 2400 first to use FOWLP tech for improved thermal management"
The post Samsung Exynos 2400 first to use FOWLP tech for improved thermal management first appeared on Fone Arena.
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