At the TSMC North America Technology Symposium, the company showcased its advanced logic, speciality, and 3D IC technologies as well as N2 process powered by nanosheet transistors and the unique FINFLEX technology for the N3 and N3E processes. It also has N3P, a performance-enhanced version, N3S, a density-enhancing version and the N3X, an ultra-high performance … Continue reading "TSMC N2 2nm process tech in 2025; five 3nm process technologies announced"
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