HUAWEI just announced Kirin 990 and Kirin 990 5G SoCs at its IFA event as expected. The Kirin 990 is based on Taiwan Semiconductor Manufacturer Company’s (TSMC) 7nm process, while the Kirin 990 5G that has built-in 5G modem supporting Sub-6 GHz 5G networks on both SA and NSA architectures and uses TSMC’s latest 7nm plus EUV manufacturing, which helps enable a smaller die size offering 36% board reduction, increased transistor density by 18% and 10% improvement in energy efficiency. These have 16-Core Mali-G76 GPU, compared to 10-Core in the Kirin 980 SoC offering 6% improvement in graphics processing performance. The built-in 5G modem in the Kirin 990 5G offers up to 2.3Gbps download speed and 1.25 Gbps upload speed. Combined with LTE, this will offer up to 3.3Gbps download speed and up to 1.32Gbps upload speed. The SoCs have 2 (Big Core) performance + 1 (Smaller Core) ultra lower consumption Da Vinci-based NPU. The 990 5G promises 20% increase in energy efficiency, and a 40% savings in bandwidth in high-bandwidth scenarios compared to Kirin 980. Kirin 990 5G adopts new ISP 5.0, the throughput rate is increased by 15%, the energy efficiency is increased by 15%, the video processing capability ...
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